Zero-Quiescent Power Transceiver

Trillions of sensors are envisioned to achieve the potential benefits of the internet of things.  Realizing this potential requires wireless sensors with low power requirements such that there might never be a need to replace a sensor’s power supply (e.g. battery) over the lifetime of that device.   The battery lifetime of wireless communications devices […]

Zero-footprint Metrology Microsystem

In order to enable the reliable reproducibility of micro-scale devices used in high volume, low cost integrated circuit manufacturing, process parameters need to be directly measured and monitored during manufacturing. Probing optical beams that are directed from external photo sources have been used to probe in-situ information such as film thickness, material density, and refractive […]

Wirelessly Powered Microfluidic Devices

UC San Diego researchers have developed concepts and methods for incorporating printed integrated circuits into microfluidic devices and powering such electronic microfluidic devices wirelessly. In one example, the circuit elements (capacitors, diodes, gates, wires, and electrodes) were roll-to-roll printed on the plastic substrate containing the microfluidic structures and powering was accomplished by wireless coupling from […]

Wireless Systems For Process Monitoring

Chemical, biochemical and agricultural processes such as fermentation, vaccine production, require close monitoring for quality control and process optimization. For some processes, production of gaseous emissions must be constantly monitored to insure worker safety or compliance with environmental regulations. Systems for many of these process monitoring applications can be very expensive and inflexible; for example […]

Web-Enabled Devices

In the past, before a device could communicate with a web server, software and configuration files needed to be installed. The software was needed to outline how the web server should communicate with the device and what protocols to use. There are several disadvantages to this method. First, this method requires the device to know […]

Warp processor for dynamic translation of binaries to FPGA circuits

UC researchers have invented a warp processor, a microprocessor that allows the dynamic and transparent partitioning of an executing software’s binary kernels into customized FPGA circuits resulting in 2 to 100 times speed up over executing on microprocessors. The UC invention’s dynamic approach allows techniques associated with dynamic software optimization to be applied to hardware/software partitioning. The […]

Wafer-Level Micro-Glass Blowing

This invention describes a process for shaping glass on a wafer scale and how multiple micro-glass spheres can be formed simultaneously on a silicon substrate. These wafer attached spheres allow for integration with conventional micro-fabricated components and can be filled with any type of gas in post-fabrication. Large scale confinement chambers have been created in […]

Wafer Scale Glass Blowing

This invention describes a process for shaping glass on a wafer scale and how multiple micro-glass spheres can be formed simultaneously on a silicon substrate. These wafer attached spheres allow for integration with conventional micro-fabricated components and can be filled with any type of gas in post-fabrication. Large scale confinement chambers have been created in […]

Wafer Level Chip Scale Packaging Technology For Integrated Mems Devices

Integrated microelectromechanical systems (MEMS) packaging process at the waver-level scale is an important technology for various devices. For example, in a MEMS accelerometer, the central sensor is a free-standing microstructure and it is desirable to protect this sensor. Moreover, it may be necessary for some MEMS devices to encapsulate the microstructures in vacuum environment for […]