A Wafer-Level Process for Bulk Tungsten Integration in MEMS Vibration Energy Harvesters and Inertial Sensors

Inertial MEMS devices generally comprise several structures, namely one or more masses, which provide sensitivity to movements, and one or more cantilevered beams (acting as springs), which support the masses. Both are traditionally made from the same material (i.e., crystalline silicon wafers). This invention proposes to rather use a high density metal (e.g., tungsten) to form the masses in these devices through a heterogeneous, parrallel integration process. Tungsten is more than 8 times denser than silicon and therefore allows for more compact masses and more sensitive devices.The present invention consists of a set of manufacturing processes for defining and integrating in parallel several masses of tungsten from a slice or sheet of thick bulk tungsten (>100 μm) into MEMS inertial devices. Those MEMS devices could be microsensors, such as accelerometers and gyroscopes for measuring positions and movements, or microgenerators for generating electricity from ambient vibrations perceived by the device Josianne Vigneault j.vigneault@transfertech.ca 819 679-5316

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