C2018-30 – Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling

Technology # 18-30 Enhanced Heat Sink with Helical Fin Design for Electronics Cooling In electronics, an increase in heat transfer is caused by the presence of cooler fluid coming into contact with hotter fluid. In other words, as the fluid passes over the heat sink, it heats up. There is a new invention for a helical fin design heat sink that allows for the warm fluid to come into contact with cooler areas and recirculate throughout the system further cooling the fins. Due to the current industry‚ interest in developing non-metallic heat sinks to avoid issues with high density electrical systems, this method has the potential to have a large impact. Technology Ventures ventures@uark.edu 479-575-7243

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