Connecting Metal Foils/Wires and Component Pins in 3D Printed Substrates with Wire Bonding

The University of Texas at El Paso seeks a partner for licensing a system for wire bonding that connects metal pins in 3D printed substrates. The system allows isolated metal structures to be electronically and mechanically interconnected for improvedsystem integration. Chao Zhang czhang3@utep.edu 915-747-6717

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