Method for forming a contact layer having strong adhesion and exceptional uniformity on semiconductor or thermoelectric substrate

Problem: Difficult to electroplate on low surface energy substrates Technology: This invention relates to a thin nanoparticle layer or self-assembled monolayer being initially deposited onto a semiconductor or thermoelectric substrate for electroplating an electrically conducting material and having strong adhesion and exceptional uniformity. The invention uses a seed layer that strongly adheres to the substrate to serve as nucleation sites. It is also discovered that these seed layers open up a voltage range such that metals can be selectively deposited onto the predetermined seeded regions only, thus opening new routes for selective area deposition. Christopher Noble crn@mit.edu

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