Method for forming a contact layer having strong adhesion and exceptional uniformity on semiconductor or thermoelectric substrate

Problem: Difficult to electroplate on low surface energy substrates Technology: This invention relates to a thin nanoparticle layer or self-assembled monolayer being initially deposited onto a semiconductor or thermoelectric substrate for electroplating an electrically conducting material and having strong adhesion and exceptional uniformity. The invention uses a seed layer that strongly adheres to the substrate to serve as nucleation sites. It is also discovered that these seed layers open up a voltage range such that metals can be selectively deposited onto the predetermined seeded regions only, thus opening new routes for selective area deposition. Christopher Noble

Related Blog

Smart, interactive desk

Get ready to take your space management game to the next level with the University of Glasgow’s innovative project! By combining the

Mechanical Hamstring™

University of Delaware Technology Overview This device was created to allow athletes who suffer a hamstring strain to return to the field

Join Our Newsletter

                                                   Receive Innovation Updates, New Listing Highlights And More