Out-of-autoclave curing system – IP 1224

FIU inventors fabricated a novel way to cure and bondsubstrates together without the possible damage to the substrates that may becaused from reheating during secondary curing. This method utilizes adhesives and a mesh for controllingbond line thickness. The mesh includes fiber optic filaments that can beirradiated with UV light which in turns radiates the adhesive bonding thesubstrates together. This curing method is highly applicable to many substratesand materials. We are seeking business partners to further develop andcommercialize the Out-of-Autoclave Curing System as a viable alternative toexisting curing systems that can be used to cure any substrate regardless ofsize, shape, and thickness. Shantanu Balkundi sbalkund@fiu.edu 305-348-8061

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